Converting
Sputtering is a method of coating a film (see substrate) with a thin coat of an inorganic material (see coatings). This process takes place in a high vacuum chamber. The target material (from which the sputtered coating originates) is placed upon a cathode located beneath the substrate to be coated. The substrate is continuously moving through this deposition zone. A negative voltage is applied to the target material causing charged particles to attract to the target’s surface. An inert gas is fed into the deposition zone in close proximity to the cathode. Positive ions from the inert gas are attracted to the negative target at high energy where they collide and liberate target atoms. The target atoms accelerate in the direction of the substrate where they condense and bond to the surface creating a precision coating. Usually more than one target atom is ejected per inert gas atom collision. This is referred to as the sputtering yield, thus causing process speed relative to coating thickness to vary from material to material.
Magnatron sputtering provides outstanding adhesion, uniform coating and allows the deposition of refractory metals and alloys. Through the use of reactive techniques, Techni-Met can create compound coatings such as oxides or nitrates during the sputtering process. All coatings designed by Techni-Met provide specialized physical, electrical, chemical and optical properties.
