What
is Sputtering?
Sputtering is a
method of coating a film (see substrate)
with a thin coat of an inorganic material
(see coatings). This process takes place
in a high vacuum chamber. The target material (from which the sputtered
coating originates) is placed upon a cathode located beneath the substrate
to be coated. The substrate is continuously moving through this deposition
zone. A negative voltage is applied to the target material causing charged
particles to attract to the target’s surface. An inert gas is fed
into the deposition zone in close proximity to the cathode. Positive
ions from the inert gas are attracted to the negative target at high
energy where they collide and liberate target atoms. The target atoms
accelerate in the direction of the substrate where they condense and
bond to the surface creating a precision coating. Usually more than one
target atom is ejected per inert gas atom collision. This is referred
to as the sputtering yield, thus causing process speed relative to coating
thickness to vary from material to material.
Magnatron sputtering provides outstanding adhesion, uniform coating and
allows the deposition of refractory metals and alloys. Through the use
of reactive techniques, Techni-Met can create compound coatings such
as oxides or nitrates during the sputtering process. All coatings designed
by Techni-Met provide specialized physical, electrical, chemical and
optical properties.
